The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Apr. 04, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Byounghoon Lee, Suwon-si, KR;

Jongho Park, Suwon-si, KR;

Wandon Kim, Seongnam-si, KR;

Sangjin Hyun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 21/762 (2006.01); H01L 21/8234 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 29/0673 (2013.01); H01L 29/1037 (2013.01); H01L 29/42392 (2013.01); H01L 29/4966 (2013.01); H01L 21/02532 (2013.01); H01L 21/28088 (2013.01); H01L 21/30604 (2013.01); H01L 21/32139 (2013.01); H01L 21/76224 (2013.01); H01L 21/823412 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/82345 (2013.01); H01L 21/823468 (2013.01); H01L 21/823481 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01); H01L 29/7848 (2013.01);
Abstract

A semiconductor device includes a plurality of semiconductor patterns that are sequentially stacked and spaced apart from each other on a substrate, and a gate electrode on the plurality of semiconductor patterns. The gate electrode includes a capping pattern and a work function pattern that are sequentially stacked on the plurality of semiconductor patterns. The capping pattern includes a first metal nitride layer including a first metal element, and a second metal nitride layer including a second metal element whose work function is greater than a work function of the first metal element. The first metal nitride layer is disposed between the second metal nitride layer and the plurality of semiconductor patterns. The first metal nitride layer is thinner than the second metal nitride layer.


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