The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 03, 2019
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Dohee Kim, Seoul, KR;

Gunho Kim, Seoul, KR;

Yongil Shin, Seoul, KR;

Bongchu Shim, Seoul, KR;

Hyunwoo Cho, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 2224/29021 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95133 (2013.01); H01L 2224/95136 (2013.01);
Abstract

The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.


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