The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jan. 19, 2022
Quanzhou Sanan Semiconductor Technology Co., Ltd., Quanzhou, CN;
Zhen-Duan Lin, Xiamen, CN;
Yanqiu Liao, Xiamen, CN;
Shuning Xin, Xiamen, CN;
Weng-Tack Wong, Xiamen, CN;
Junpeng Shi, Xiamen, CN;
Aihua Cao, Xiamen, CN;
Changchin Yu, Xiamen, CN;
Chi-Wei Liao, Xiamen, CN;
Chen-ke Hsu, Xiamen, CN;
Zheng Wu, Xiamen, CN;
Chia-en Lee, Xiamen, CN;
Quanzhou Sanan Semiconductor Technoogy Co., Ltd., Fujian, CN;
Abstract
A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness T, the first encapsulating layer has a thickness T, in which T/T≥1.