The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Feb. 10, 2020
Rohm Co., Ltd., Kyoto, JP;
Kazunori Fuji, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
Semiconductor device Aof the disclosure includes: semiconductor elementhaving element obverse surfaceand element reverse surfacespaced apart from each other in z direction (first direction) with first regionformed on the element obverse surface; metal plate(electrode member) disposed on the element obverse surfaceand electrically connected to the first region; electrically conductive substrateA (first conductive member) disposed to face the element reverse surfaceand bonded to the semiconductor element; electrically conductive substrateB (second conductive member) spaced apart from the conductive substrateA (first conductive member); and lead member(connecting member) electrically connecting the metal plate(electrode member) and the conductive substrateB (second conductive member). The lead member(connecting member) is bonded to the metal plate(electrode member) by laser welding. The semiconductor device of this configuration provides improved reliability.