The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Oct. 02, 2023
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Heoncheol Oh, Seoul, KR;

Jaesang Min, Seoul, KR;

Yonghee Park, Seoul, KR;

Jinwoo Lee, Seoul, KR;

Heejin Cho, Seoul, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/3735 (2013.01); H02M 7/003 (2013.01);
Abstract

A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.


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