The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Mar. 28, 2022
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Timothy Martin Radloff, Austin, TX (US);

Geroncio Ong Tan, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 2224/10165 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A multi-layered structure interface between a ball grid array (BGA) device and a printed circuit board (PCB), including a ball guide layer comprising a through hole; a first elastomeric portion of a first layer in superimposition with at least a portion of the through hole, the first elastomeric portion having a first width; and a second elastomeric portion of a second layer having a second width; wherein first elastomeric portion is positioned between the through hole of the ball guide layer and the second elastomeric portion, wherein the first width of the first elastomeric portion is greater than the second width of the second elastomeric portion.


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