The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Aug. 30, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Yoshiaki Takewaki, Tokyo, JP;
Keita Motoyama, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor device capable of suppressing misalignment of a brazing material when bonding a metal terminal to a metal circuit pattern. The semiconductor device includes an insulating substrate with a metal circuit pattern formed in a surface thereof and a metal terminal bonded onto the metal circuit pattern via a hard brazing material, in which protrusions are provided on the metal circuit pattern, and the protrusions are in contact with the hard brazing material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile