The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Aug. 02, 2022
Taiyo Yuden Co., Ltd., Tokyo, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape; and external electrodes each including a base layer, a conductive resin layer, and first and second conductive layers. A conductive filler includes a core portion and a silver coating film made of silver and covering the core portion. In a cross-section parallel to the first and second axes, when a straight line parallel to the first axis is drawn to pass through a range distant from a base end portion, and when a thickness of the first conductive layer along the line is a conductor thickness, and the sum of lengths of the silver coating film along the line in all the conductive fillers on the line is a total thickness of silver coating, a ratio of the conductor thickness to the total thickness of silver coating is 2 or more and 10 or less.