The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 13, 2023
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Klaus Elian, Alteglofsheim, DE;

Derek Debie, Bogen, DE;

Fabian Streb, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/043 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01); F21K 9/64 (2016.01); F21V 9/40 (2018.01); F21V 23/04 (2006.01); F21Y 103/10 (2016.01); F21Y 107/90 (2016.01); F21Y 113/13 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
G06F 3/0436 (2013.01); B06B 1/0292 (2013.01); B06B 1/0666 (2013.01); F21K 9/64 (2016.08); F21V 9/40 (2018.02); F21V 23/0485 (2013.01); B06B 2201/55 (2013.01); F21Y 2103/10 (2016.08); F21Y 2107/90 (2016.08); F21Y 2113/13 (2016.08); F21Y 2115/10 (2016.08);
Abstract

An ultrasonic touch sensor includes a housing having a package cavity; an ultrasonic transmitter arranged within the package cavity, and configured to transmit an ultrasonic transmit wave; an ultrasonic receiver arranged within the package cavity, and configured to receive an ultrasonic reflected wave produced by a reflection of the ultrasonic transmit wave and generate a measurement signal representative of the ultrasonic reflected wave; a measurement circuit arranged within the package cavity and coupled to the ultrasonic receiver, and configured to detect a touch or a non-touch based on the measurement signal; a light source configured to produce an activating light; and a coupling medium that fills or at least partially fills the package cavity. The coupling medium includes a luminescent material that is configured to be activated by the activating light to produce a backlight that is emitted from the package cavity.


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