The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Mar. 02, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric J. Campbell, Rochester, MN (US);

Matthew Doyle, Chatfield, MN (US);

Mark J. Jeanson, Rochester, MN (US);

Gerald Bartley, Rochester, MN (US);

Darryl Becker, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/72 (2013.01); C01G 5/02 (2006.01); C09D 7/61 (2018.01); C09K 5/14 (2006.01); G01J 1/42 (2006.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); G01T 1/17 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 21/72 (2013.01); C01G 5/02 (2013.01); C09D 7/61 (2018.01); C09K 5/14 (2013.01); G01J 1/429 (2013.01); G01R 31/002 (2013.01); G01T 1/17 (2013.01); H01L 23/576 (2013.01); H05K 1/0275 (2013.01); H05K 1/181 (2013.01); G01R 31/2801 (2013.01);
Abstract

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.


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