The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jul. 22, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jeonghyeon Cho, Hwaseong-si, KR;
Yongsuk Kwon, Goyang-si, KR;
Kyungsoo Kim, Seoul, KR;
Jonghoon Kim, Seoul, KR;
Jonghyun Seok, Seoul, KR;
Jonggeon Lee, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 1/20 (2006.01); G06F 1/30 (2006.01); G06F 13/12 (2006.01); G06F 13/16 (2006.01); G06F 13/364 (2006.01); G06F 13/40 (2006.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); G11C 7/10 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 13/1673 (2013.01); G06F 13/4068 (2013.01); G06F 13/409 (2013.01); G11C 5/06 (2013.01); G11C 7/1063 (2013.01);
Abstract
A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.