The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Aug. 19, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Toshiaki Ando, Tochigi, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A molding apparatus configured to mold a cured object by bringing a mold into contact with a curable composition on a processing target substrate and curing the curable composition with the mold in contact therewith includes a priming unit configured to perform processing for applying a mold release agent onto a surface of the mold that contacts the curable composition, the priming unit being configured to apply the mold release agent onto the mold by placing a curable composition containing the mold release agent on a priming substrate, curing the curable composition while the curable composition and the mold in contact with each other, and separating the mold and the cured curable composition. The molding apparatus further includes a recovery unit configured to perform a recovery processing to recover a state of a surface of the priming substrate on which the curable composition is placed.