The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jun. 09, 2023
Applicant:

Seoul Semiconductor Co., Ltd., Ansan-si, KR;

Inventor:

Eun Ju Kim, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/133 (2006.01); F21V 8/00 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); G02F 1/1335 (2006.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133606 (2013.01); G02B 6/0016 (2013.01); G02B 6/0021 (2013.01); G02B 6/003 (2013.01); G02B 6/0036 (2013.01); G02B 6/0055 (2013.01); G02B 6/0073 (2013.01); G02B 6/0083 (2013.01); G02F 1/133605 (2013.01); G02F 1/133608 (2013.01); G02F 1/133611 (2013.01); H01L 25/0753 (2013.01); G02B 6/0043 (2013.01); G02B 6/0068 (2013.01); G02F 1/133603 (2013.01); G02F 1/133607 (2021.01); G02F 1/133614 (2021.01); H01L 25/0756 (2013.01); H01L 33/46 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A display apparatus including a frame, light emitting diode chips separated from each other and regularly arranged in a matrix on the frame, an optical part including a display panel and at least one of a phosphor sheet and an optical sheet, a light guide plate disposed between the frame and the optical part to cover the light emitting diode chips, at least one reflector disposed between the frame and the light guide plate to reflect at least part of light emitted from the light emitting diode chip to direct at least part of light emitted therefrom to the light guide plate, and a first-type electrode and a second-type electrode, in which at least one of the light emitting diode chips is a flip-chip type and includes a first-type semiconductor layer electrically connected to the first-type electrode and a second-type semiconductor layer electrically connected to the second-type electrode.


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