The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 06, 2022
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Jérôme Leclerc-Perron, Québec, CA;

Marie-Josee Picard, L'Ancienne-Lorette, CA;

Raphael Beaupré-Laflamme, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/26 (2020.01); G02B 6/12 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2886 (2013.01); G01R 31/2635 (2013.01); G02B 6/124 (2013.01); G02B 6/13 (2013.01); G02B 2006/12107 (2013.01);
Abstract

An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.


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