The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jun. 27, 2022
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Yannick Vuillermet, Voglans, FR;

Loïc André Messier, Vanzy, FR;

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/20 (2006.01); G01R 19/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01R 15/202 (2013.01); G01R 19/0092 (2013.01); H05K 1/0225 (2013.01); H05K 1/18 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10689 (2013.01);
Abstract

A current sensor system includes a current sensor integrated circuit (IC) and a printed circuit board (PCB) having a ground plane with a feature configured to reduce an eddy current. The current sensor IC includes a lead frame comprising a die attach pad and at least one lead, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface, at least one magnetic field sensing element supported by the semiconductor die and configured to sense a current in a proximate primary conductor, and a non-conductive mold material enclosing the semiconductor die and a portion of the at least one lead. The PCB ground plane feature can take various forms such as a hole of a dimension larger than the current sensor IC, elongated cuts, or x-shaped cuts.


Find Patent Forward Citations

Loading…