The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jul. 17, 2023
Applicant:
Sz Dji Technology Co., Ltd., Shenzhen, CN;
Inventors:
Guoxiu Pan, Shenzhen, CN;
Renli Shi, Shenzhen, CN;
Assignee:
SZ DJI TECHNOLOGY CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 21/00 (2006.01); B64C 39/02 (2023.01); B64U 10/13 (2023.01); B81B 7/00 (2006.01); B81C 99/00 (2010.01); G01C 25/00 (2006.01); G01D 3/036 (2006.01); G01D 18/00 (2006.01); G01K 13/00 (2021.01); G05D 1/00 (2024.01); G05D 23/19 (2006.01); B64D 43/00 (2006.01); B64U 30/20 (2023.01); B64U 101/60 (2023.01);
U.S. Cl.
CPC ...
G01P 21/00 (2013.01); B64C 39/024 (2013.01); B81B 7/0087 (2013.01); B81C 99/003 (2013.01); G01C 25/005 (2013.01); G01D 3/036 (2013.01); G01D 18/008 (2013.01); G01K 13/00 (2013.01); G05D 1/0011 (2013.01); G05D 23/19 (2013.01); B64D 43/00 (2013.01); B64U 10/13 (2023.01); B64U 30/20 (2023.01); B64U 2101/60 (2023.01); B64U 2201/20 (2023.01); B81B 2201/0242 (2013.01);
Abstract
A thermal regulation system includes an inertial measurement unit (IMU), one or more temperature adjusting devices in thermal communication with the IMU, and configured to adjust a temperature of the IMU from an initial temperature to a predetermined temperature, a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, and a shared substrate configured to bear a weight of the IMU and the one or more temperature adjusting devices. The shared substrate includes a metallic board.