The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

May. 17, 2023
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Robert Wilcox, Rolesville, NC (US);

Michael Check, Holly Springs, NC (US);

Colin Blakely, Raleigh, NC (US);

David Suich, Durham, NC (US);

Joseph G. Sokol, Durham, NC (US);

Andre Pertuit, Raleigh, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); F21K 9/237 (2016.01); F21K 9/90 (2016.01); F21V 29/71 (2015.01); F21Y 113/17 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/237 (2016.08); F21K 9/90 (2013.01); F21V 19/005 (2013.01); F21V 29/713 (2015.01); F21Y 2113/17 (2016.08); F21Y 2115/10 (2016.08);
Abstract

Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.


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