The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jan. 24, 2023
Applicant:
Mp Global Products, L.l.c., Norfolk, NE (US);
Inventors:
Alan B. Collison, Pierce, NE (US);
Carl Fuelberth, Norfolk, NE (US);
Assignee:
MP Global Products, L.L.C., Norfolk, NE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E04F 15/22 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 27/12 (2006.01); E04F 15/20 (2006.01);
U.S. Cl.
CPC ...
E04F 15/203 (2013.01); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 27/12 (2013.01); B32B 2262/0276 (2013.01); B32B 2307/102 (2013.01); B32B 2307/304 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/732 (2013.01); B32B 2471/00 (2013.01);
Abstract
A floor structure includes a subfloor, a floor covering disposed above the subfloor, and a floor lift layer disposed between the subfloor and the floor covering. The floor covering is disposed above the subfloor. The floor lift layer is a fiber structure that includes a substrate fiber bound together by a thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the floor lift layer.