The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
May. 03, 2021
Applicant:
Intevac, Inc., Santa Clara, CA (US);
Inventors:
Terry Bluck, Santa Clara, CA (US);
Samuel D. Harkness, IV, Albany, CA (US);
Assignee:
INTEVAC, INC., Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/58 (2006.01); C03C 17/34 (2006.01); C23C 14/04 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
C23C 14/5873 (2013.01); C03C 17/3411 (2013.01); C23C 14/042 (2013.01); H04M 1/0283 (2013.01); C03C 2217/425 (2013.01); C03C 2217/45 (2013.01);
Abstract
A method for forming thin film layer having micro-voids therein. The method proceeds by dispersing micro-particles over the surface of a substrate. The micro particles are made of sublimable material. Then the thin film layer is formed over the surface, so as to cover the particles. The thin film is then etched back so as to expose the particles at least partially. The material of the particles is then sublimed, e.g., by heating the substrate, thereby leaving micro-voids inside the thin film layer. The micro voids can be filled or remain exposed to generate textured surface.