The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 16, 2022
Applicant:

Winpak Ltd., Winnipeg, CA;

Inventors:

Chen Wan, Kingwood, TX (US);

Ming-Lun Wu, Richmond, TX (US);

Assignee:

Winpak Ltd., Winnipeg, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01);
U.S. Cl.
CPC ...
C08L 23/12 (2013.01); C08L 2205/025 (2013.01);
Abstract

Described herein are high stiffness, snappable food contact material compositions containing at least one polypropylene, a hydrocarbon resin, and optionally one or more other additives. The disclosed compositions exhibit a combination of mechanical, chemical, and/or optical properties that enable wider use of such polypropylene-based compositions in food packaging applications, including in Form-Fill-Seal food packaging where high stiffness, snappability, thin walls, and good clarity are important factors. Also described herein are articles comprising the disclosed compositions and methods of manufacturing such articles.


Find Patent Forward Citations

Wan, Chen. (2024). High stiffness, clarified polypropylene compositions having improved properties for food packaging (U.S. Patent No. 12077661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12077661

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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