The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Nov. 08, 2020
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Prashant Patil, Cambridge, MA (US);

Neil Gershenfeld, Somerville, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B23K 26/00 (2014.01); B23K 26/354 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00547 (2013.01); B23K 26/0006 (2013.01); B23K 26/354 (2015.10); B81C 1/00611 (2013.01); B81C 1/00904 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B81C 2201/0125 (2013.01); B81C 2201/0143 (2013.01); B81C 2203/032 (2013.01); B81C 2203/054 (2013.01);
Abstract

A laser micro-machining process called laser-assisted material phase-change and expulsion (LAMPE) micromachining that includes cutting features in a cutting surface of a piece of material using a pulsed laser with intensity, pulse width and pulse rate set to melt and eject liquid material without vaporizing said material, or, in the case of silicon, create an ejectible silicon oxide. Burrs are removed from the cutting surface by electro-polishing the cutting surface with a dilute acid solution using an electric potential higher than a normal electro-polishing electric potential. A multi-lamina assembly of laser-micro-machined laminates (MALL) may utilize MEMS. In the MALL process, first, the individual layers of a micro-electromechanical system (MEMS) are fabricated using the LAMPE micro-machining process. Next, the fabricated microstructure laminates are stack assembled and bonded to fabricate MEM systems. The MALL MEMS fabrication process enables greater material section and integration, greater design flexibility, low-cost manufacturing, rapid development, and integrated packaging.


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