The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Feb. 27, 2020
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Lars Tebje, Reutlingen, DE;

Jochen Reinmuth, Reutlingen, DE;

Johannes Classen, Reutlingen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01C 19/5783 (2012.01); G01L 7/08 (2006.01); G01L 19/00 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81C 1/00341 (2013.01); G01C 19/5783 (2013.01); G01L 7/082 (2013.01); G01L 19/0092 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0105 (2013.01); B81C 2201/014 (2013.01);
Abstract

A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.


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