The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jul. 01, 2020
Omron Corporation, Kyoto, JP;
Norihito Hiramitsu, Kyoto, JP;
Takekazu Komori, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
In order to thermally cure a thermosetting adhesive quickly and with less energy, the bonded article () according to the present invention comprises an adherend member () having a thermal conductivity of 1 w/m·K or more, an adherend member () made of a material which can adhere to the adherend member (), and an adhesion portion that is formed of a cured product of a thermosetting adhesive () and that is in contact with both the adherend member () and the adherend member (), wherein the adherend member () has a heat transfer-inhibiting structure () which inhibits the transfer of heat from a portion thereof in contact with the adhesive () to a peripheral portion thereof.