The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Oct. 11, 2021
The Yokohama Rubber Co., Ltd., Kanagawa, JP;
Yukihiro Kamimura, Kanagawa, JP;
Tomohiro Ito, Kanagawa, JP;
The Yokohama Rubber Co., LTD., Tokyo, JP;
Abstract
A method of molding a sandwich panel includes a step of providing, on one or both surfaces of an (a) core material, a prepreg or the prepreg and an adhesive as a (b) skin material. The (a) core material is a super engineering plastic foam having a glass transition temperature of greater than 200° C. The (b) skin material contains: a (b-1) epoxy resin having an average molecular weight of 1300 or more or having a trishydroxymethane-type or cresol novolac-type structure and containing, in a total epoxy resin, an amount of 70 to 100 mass % of an epoxy resin that is semi-solid or solid; a (b-2) epoxy resin containing, in the total epoxy resin, an amount of 0 to 30 mass % of an epoxy resin that is liquid; and a (b-3) curing agent.