The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Jun. 26, 2020
Applicant:
Xefco Pty Ltd, Lilyfield, AU;
Inventors:
Thomas Hussey, Drummoyne, AU;
Scott Whitby, Chatswood, AU;
Assignee:
XEFCO PTY LTD, Lilyfield, AU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 3/20 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/05 (2019.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 7/05 (2019.01); B32B 3/20 (2013.01); B32B 5/022 (2013.01); B32B 5/266 (2021.05); B32B 9/007 (2013.01); B32B 9/047 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 2255/02 (2013.01); B32B 2262/0215 (2013.01); B32B 2307/304 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/40 (2013.01); B32B 2307/728 (2013.01); B32B 2307/73 (2013.01); B32B 2307/754 (2013.01); B32B 2437/00 (2013.01);
Abstract
The present disclosure may be directed towards a substrate with an array disposed thereon. The substrate comprising a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The low emissivity layer may be a metal layer which functions as a radiant barrier.