The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Mar. 19, 2020
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Yuichi Yui, Tokyo, JP;
Akihisa Okuda, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A method for molding a composite material includes arranging a prepreg on a jig molding surface of a jig for molding. The method includes sealing a first endless seal region that surrounds the prepreg is formed by bonding a resin bag and the jig molding surface by a first sealing material and a second endless seal region that surrounds the prepreg and is positioned outside the first seal region is formed by bonding a resin bag and the jig molding surface by a second sealing material. The method includes depressurizing a first space inside the first seal region and a second space between the first seal region and the second seal region are depressurized. The method includes thermally curing the prepreg by supplying a water vapor into the internal space of a pressure vessel, while holding the pressure vessel in a sealed state.