The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Apr. 30, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Victor Diego Gutierrez, Sant Cugat del Valles, ES;

Manuel Freire Garcia, Sant Cugat del Valles, ES;

Enrique Gurdiel Gonzalez, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B22F 10/80 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B29C 64/165 (2017.01); B29C 64/386 (2017.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 10/80 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/14 (2021.01); B22F 10/28 (2021.01);
Abstract

In an example, a method includes receiving, by at least one processor, object model data representing at least a portion of a first object that is to be generated by an additive manufacturing apparatus. An indication of a proportion of the first object which is solid may be determined, and, based thereon, a dimensional compensation value may be determined. The determined dimensional compensation value may be applied to the object model data to determine modified object model data.


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