The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
May. 29, 2019
Hewlett-packard Development Company, L.p., Spring, TX (US);
Stan E. Leigh, Corvallis, OR (US);
Karsten N. Wilson, Corvallis, OR (US);
Anthony Holden, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
According to one aspect, there is provided a method of selectively solidifying successive layers of build material in a 3D printing system. The method comprises obtaining data relating to a 3D object to be generated, forming a layer of build material on a build platform, applying to the formed layer a pattern of fusing agent corresponding to a portion of the layer to be solidified to form a layer of the object, applying to the formed layer a pattern of anti-caking agent on portions of the formed layer that are not to be solidified to form a layer of the object, and applying energy to the whole of the formed layer to cause portions of the layer on which fusing agent was applied to heat up, melt, coalesce, and then solidify upon cooling, and to cause portions of the formed layer on which anti-caking agent was applied to control caking of build material in those portions.