The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Jan. 25, 2022
Applicant:
Fujifilm Business Innovation Corp., Tokyo, JP;
Inventors:
Yasuo Matsumura, Kanagawa, JP;
Sumiaki Yamasaki, Kanagawa, JP;
Tsuyoshi Murakami, Kanagawa, JP;
Kana Yoshida, Kanagawa, JP;
Shuji Sato, Kanagawa, JP;
Assignee:
FUJIFILM Business Innovation Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1266 (2013.01); H05K 1/0298 (2013.01); H05K 1/188 (2013.01); H05K 3/025 (2013.01);
Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.