The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Apr. 05, 2021
Applicant:

Vuereal Inc., Waterloo, CA;

Inventor:

Gholamreza Chaji, Waterloo, CA;

Assignee:

VueReal Inc., Waterloo, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); G01R 31/26 (2020.01); H01L 21/66 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/6835 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H05K 13/0015 (2013.01); H05K 13/0069 (2013.01); H05K 13/04 (2013.01); G01R 31/2635 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 25/50 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/27002 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83141 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/8316 (2013.01); H01L 2224/8318 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83234 (2013.01); H01L 2224/83238 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83902 (2013.01); H01L 2224/95 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01);
Abstract

What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.


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