The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Sep. 24, 2020
Applicant:

Sony Interactive Entertainment Inc., Tokyo, JP;

Inventors:

Minoru Wakabayashi, Tokyo, JP;

Yosuke Maki, Tokyo, JP;

Yuito Tsuji, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/46 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A multilayer printed circuit board includes a plurality of conductive layers formed by a conductive material, in which a blank region with the conductive material removed is formed in at least part of at least an intermediate conductive layer that is formed inside the multilayer printed circuit board, among the plurality of conductive layers, a plurality of island regions are formed by the conductive material included in the intermediate conductive layer in the blank region, and each of the plurality of island regions is not electrically connected to other regions included in the intermediate conductive layer and is disposed so as to be dispersed from one another.


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