The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Apr. 18, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Takayuki Shinozaki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/04 (2006.01); H04B 1/03 (2006.01); H04B 1/08 (2006.01);
U.S. Cl.
CPC ...
H04B 1/04 (2013.01); H04B 1/03 (2013.01); H04B 1/08 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.


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