The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Apr. 23, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Hiroaki Iida, Tochigi, JP;
Shogo Tokita, Tochigi, JP;
HITACHI ASTEMO, LTD., Hitachinaka, JP;
Abstract
A technology that prevents an encapsulation member encapsulating a semiconductor element from leaking between a resin-made casing and a heat dissipator is provided. A power conversion device includes a heat dissipator that includes a mount surface on which semiconductor elements are mounted, a resin-made casing that includes an intimate-contact surface that intimately contacts the mount surface, and which contains therein the semiconductor elements, and an encapsulation member that encapsulates the semiconductor elements within the casing. A first surrounding portion that surrounds the semiconductor elements is provided on the mount surface of the heat dissipator. A second surrounding portion that surrounds the semiconductor elements is provided on the intimate-contact surface of the casing. The first surrounding portion and the second surrounding portion are fitted with each other in the concavo-convex shape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile