The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Nov. 06, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hiroki Suzuki, Tokyo, JP;

Keiichiro Shizu, Tokyo, JP;

Tomohiro Kutsuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/158 (2006.01); F25B 49/02 (2006.01); H02M 1/32 (2007.01); H02M 7/06 (2006.01); H02P 27/06 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02M 1/32 (2013.01); F25B 49/022 (2013.01); H02M 7/06 (2013.01); H02P 27/06 (2013.01); H05K 7/209 (2013.01); F25B 2600/021 (2013.01);
Abstract

A direct current power supply device includes a rectifier circuit that rectifies alternating current power supplied from an alternating current power supply and converts the alternating current power into direct current power, a charge storage unit that includes a function of storing a charge, a charger that charges the charge storage unit, and a heat sink. The charger includes a positive-side switching element, a negative-side switching element, a positive-side backflow prevention diode, and a negative-side backflow prevention diode. The positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode are discrete semiconductor elements. The negative-side backflow prevention diode is a full mold package element. The positive-side switching element, the negative-side switching element, and the positive-side backflow prevention diode are elements that are not full mold packages.


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