The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Jan. 09, 2020
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Naoki Kakoiyama, Kanagawa, JP;
Shuichi Oka, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
To eliminate influence caused by a difference in coefficient of linear expansion between a substrate and another material, and to secure a stable mounting structure of a semiconductor element. A semiconductor device includes a glass substrate and the semiconductor element. The glass substrate includes a through hole that penetrates front and back surfaces. Furthermore, the glass substrate includes a stepped portion on an outer periphery of the through hole. The semiconductor element is joined to the stepped portion of the glass substrate. For example, in a case where an imaging element is used as the semiconductor element, image quality of an image obtained by imaging is improved by preventing defocus of light incident on the imaging element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile