The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
May. 22, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yo Tanaka, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/12 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 2224/05101 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/4846 (2013.01);
Abstract
A semiconductor device includes a first circuit, a second circuit, a wiring member, and a bonding material. The wiring member is connected to one of the first circuit and the second circuit. The bonding material is connected to the other of the first circuit and the second circuit. The wiring member includes a first end, a second end, and a top. The first end and the second end are connected to one of the first circuit and the second circuit. The top is located between the first end and the second end. The top is connected to the other of the first circuit and the second circuit with the bonding material in between.