The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Nov. 23, 2021
Applicant:

Rising Technologies Co., Ltd., Yokohama, JP;

Inventor:

Shuzo Akejima, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 23/488 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 24/73 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82106 (2013.01);
Abstract

An electronic circuit device includes a plane-shaped shield member having conductivity, at least one electronic circuit element having a first surface opposed to a second surface on which a connecting part is formed, the first surface arranged on the plane-shaped shield member, a rewiring layer comprises an insulating photosensitive resin layer enclosing the electronic circuit element on the plane-shaped shield member, a plurality of wiring photo vias having a plurality of first conductors electrically connected to a connecting part of the electronic element, a wiring having a second conductor electrically connected to each of the plurality of wiring photo vias on the same surface parallel to the plane-shaped shield member, and a wall-shaped shield groove having a third conductor for a sealing arranged to surround a thickness direction of the electronic circuit element.


Find Patent Forward Citations

Quick Actions:

Akejima, Shuzo. (2024). Electronic circuit device (U.S. Patent No. 12074130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12074130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…