The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Sep. 24, 2020
Applicant:
Macom Technology Solutions Holdings, Inc., Lowell, MA (US);
Inventors:
Richard Wilson, Morgan Hill, CA (US);
Madhu Chidurala, Los Altos, CA (US);
Assignee:
MACOM Technology Solutions Holdings, Inc., Lowell, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/08 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48157 (2013.01);
Abstract
A multi-level radio frequency (RF) integrated circuit component includes an upper level including at least one inductor, and a lower level including at least one conductive element that provides electrical connection to the at least one inductor. The lower level separates the at least one inductor from a lower surface that is configured to be attached to a conductive pad. Related integrated circuit device packages are also discussed.