The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Aug. 20, 2021
Applicant:
Zeus Co., Ltd., Hwaseong-si, KR;
Inventors:
Woon Kong, Cheonan-si, KR;
Ji Hoon Song, Cheonan-si, KR;
Ung Jo Moon, Osan-si, KR;
Ji Ho Park, Hwaseong-si, KR;
Assignee:
ZEUS CO., LTD., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/68721 (2013.01); H01L 21/68764 (2013.01); H01L 21/68728 (2013.01); Y10T 279/11 (2015.01);
Abstract
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.