The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Dec. 23, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Shun Takai, Nagaokakyo, JP;

Atsuo Hirukawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/324 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01);
Abstract

A multilayer coil component includes an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. The insulator portion is a multilayer body including first and second insulator layers. The coil conductor layers and the second insulator layers are disposed on the first insulator layers. The multilayer coil component has void layers (e.g., voids) between the first insulator layers and at least a portion of the coil conductor layers. If the thickness of the first insulator layers is a, the thickness of the coil conductor layers is b, and the thickness of the void layers is c, the ratio of c to b (c/b) is 0.10 to 0.70, and the ratio of a to b (a/b) is 0.25 to 1.00.


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