The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Sep. 13, 2021
Applicant:

Shenzhen Sunlord Electronics Co., Ltd., Guangdong, CN;

Inventors:

Yihua Yang, Guangdong, CN;

Xianren Chen, Guangdong, CN;

Zhongdong Wu, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2885 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 27/324 (2013.01); H01F 2017/008 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A laminated shielding inductor includes a laminated body, an internal coil, and a shielding cover; the laminated body includes a plurality of insulator layers; shielding conductor through grooves which are located at the periphery of the internal coil are formed in the plurality of insulator layers; shielding conductors are arranged in the shielding conductor through grooves, are electrically and mutually connected and jointly form a shielding conductor laminated layer; a shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal coil; and the shielding conductor laminated layer, the shielding conductor upper layer and the shielding conductor lower layer are closed to form the shielding cover. Thus, high shielding effect of the laminated chip inductor can be realized, external radiation of the laminated chip inductor is effectively reduced, and the reliability of a circuit system is improved.


Find Patent Forward Citations

Loading…