The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Jun. 23, 2021
Mitsubishi Chemical Corporation, Tokyo, JP;
Hiroya Fukuda, Toyohashi, JP;
Osamu Numata, Toyohashi, JP;
Hironobu Ikeda, Otake, JP;
Toshio Nagasaka, Toyohashi, JP;
Shinji Saiki, Otake, JP;
Hiroaki Iriyama, Otake, JP;
Masashi Uzawa, Toyohashi, JP;
Asako Kaneko, Toyohashi, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×10Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.