The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Aug. 19, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Sung Ok Kim, Asan-si, KR;
Min Woo Kim, Cheonan-si, KR;
Ho Gyung Kim, Cheonan-si, KR;
Dahm Yu, Asan-si, KR;
Jae Hyun Kim, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/27 (2006.01); G01R 31/28 (2006.01); G01R 31/3183 (2006.01);
U.S. Cl.
CPC ...
G01R 31/275 (2013.01); G01R 31/2862 (2013.01); G01R 31/2872 (2013.01); G01R 31/2889 (2013.01); G01R 31/318314 (2013.01);
Abstract
A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.