The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Dec. 18, 2020
Applicant:
Daicel-evonik Ltd., Tokyo, JP;
Inventors:
Assignee:
DAICEL-EVONIK LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C08L 77/06 (2006.01); C09J 7/28 (2018.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); C08L 77/06 (2013.01); C09J 7/28 (2018.01); C09J 2477/00 (2013.01);
Abstract
[Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.