The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Nov. 26, 2019
Applicant:

Avery Dennison Corporation, Mentor, OH (US);

Inventors:

Mahesh Ganesan, Beachwood, OH (US);

Henry Milliman, Willoughby, OH (US);

Joseph L. Meckler, Cleveland, OH (US);

Assignee:

Avery Dennison Corporation, Mentor, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/30 (2018.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01);
U.S. Cl.
CPC ...
C09J 7/30 (2018.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01); C09J 2301/122 (2020.08); C09J 2301/124 (2020.08); C09J 2301/30 (2020.08); C09J 2433/00 (2013.01); C09J 2483/00 (2013.01);
Abstract

Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.


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