The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Mar. 08, 2023
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kotaro Maeda, Kanagawa, JP;

Norihide Shimohara, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B41M 5/00 (2006.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B41M 5/0017 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); H01B 5/14 (2013.01); H01B 13/0016 (2013.01);
Abstract

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.


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