The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Mar. 16, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Naohiro Nakagawa, Matsumoto, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/1607 (2013.01); B41J 2/1626 (2013.01);
Abstract
A manufacturing method of a liquid ejecting head which has a nozzle and a liquid flow path having a pressure chamber to which a pressure for ejecting droplets from the nozzle is applied, and where a first flow path substrate and a second flow path substrate are bonded to each other, the method including: a direct bonding step of directly bonding the first flow path substrate and the second flow path substrate without using an adhesive; and a thinning step of making the second flow path substrate thinner than the first flow path substrate after the direct bonding step.