The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Sep. 12, 2019
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Ryo Fujiwara, Tokyo, JP;

Masahiro Imai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/00 (2021.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/10 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/129 (2021.01); H01M 50/14 (2021.01); H01M 50/141 (2021.01); H01G 11/60 (2013.01); H01G 11/62 (2013.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/10 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/129 (2021.01); H01M 50/14 (2021.01); H01M 50/141 (2021.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/54 (2013.01); B32B 2307/581 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7246 (2013.01); B32B 2311/24 (2013.01); B32B 2315/02 (2013.01); B32B 2323/10 (2013.01); B32B 2329/04 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01); H01G 11/60 (2013.01); H01G 11/62 (2013.01);
Abstract

A power storage device packaging material has good flexibility, and has electrolytic solution resistance. A power storage device packaging material in which a plurality of films are laminated, the packaging material including a heat-sealable resin layer, a gas barrier film layer laminated and disposed on one surface of the heat-sealable resin layer, and a plurality of adhesive layers, wherein the gas barrier film layer includes a resin base material and a gas barrier film disposed on one surface or both surfaces of the resin base material, and of the plurality of adhesive layers, at least an adhesive layer disposed between the heat-sealable resin layer and the gas barrier film layer has electrolytic solution resistance.


Find Patent Forward Citations

Fujiwara, Ryo. (2024). Power storage device packaging material, method for producing power storage device packaging material, and power storage device (U.S. Patent No. 12070934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12070934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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