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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12070801 B1

PDFFull Text
Date of Patent:
Aug. 27, 2024

Filed:

Mar. 02, 2020

Bonding material and bonded structure

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Kei Anai, Ageo, JP;

Jung-Lae Jo, Ageo, JP;

Assignee:

Mitsui Mining & Smelting Co., Ltd., , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Xiaobei Wang

Int. Cl.
CPC ...
B22F 7/08 (2006.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/145 (2022.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B32B 15/01 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B22F 7/08 (2013.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/0551 (2022.01); B22F 1/056 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/147 (2022.01); B23K 35/0238 (2013.01); B23K 35/302 (2013.01); B32B 15/01 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); B22F 2301/10 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/45147 (2013.01);
Abstract

A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.

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