The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Dec. 23, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Neil Ebejer, Lausanne, CH;

Ute Drechsler, Rueschlikon, CH;

Patrick Ruch, Pratval, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/145 (2006.01); A61B 5/00 (2006.01); A61B 5/1473 (2006.01); H05K 3/00 (2006.01); A61B 10/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/14514 (2013.01); A61B 5/1473 (2013.01); A61B 5/685 (2013.01); H05K 3/0014 (2013.01); A61B 2010/008 (2013.01); A61B 2562/125 (2013.01); B81C 2201/0101 (2013.01); B81C 2201/0108 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0147 (2013.01); B81C 2201/056 (2013.01);
Abstract

A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.


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